Starline always pays special attention to its customers’ specific needs and requests: for this reason, we have decided to invest in innovative technologies such as low pressure moulding. By using this technology, we are able to offer our customers an innovative service and, above all, we are able to solve problems that customers are likely to encounter when using standard methods of encapsulation.
About Low Pressure Moulding:
Low pressure moulding is an innovative technology made by using polyamide-based resins (e.g. TECHNOMELT ®). Through this process it is possible to encapsulate particularly fragile electrical and electronic components, making them more robust, insulated from external agents and ready to use. In fact, thanks to the low injection pressures, we can apply this process also on the main electronic components (both traditional and smd) on PCBs, without damaging them.
This moulding technique reduces the duration of the production
cycle, compared both to potting, which requires long curing times, and to traditional moulding, which involves subsequent assembly phases.
Through low pressure moulding the process will take just a few minutes to obtain a finished product ready for use. This process does not involve any additional step. In addition, you will spare time and money. Finally, you can obtain a precise design, which will result in minimizing the size and containing material costs.
Placement of the PCB or other moulding device, moulding, removal
of the final product
Moulded cable fairleads
This technology allows us to create custom-made cable fairleads . The end result is a bespoke finished product incorporated on the cable, thus, preventing any coupling that could generate infiltrations.
Insulation of PCBs and sensors
Thanks to the low injection pressures, it is possible to apply this process also on the main electronic components (both traditional and smd) on PCBs, without damaging them . The result is a ready to use and solid finished product, which is protected from external agents such as dust, water, humidity.
Technomelt resins can also be used to mould connectors, thus offering the customer the highest degree of flexibility on finished products. By way of example, it is possible to transform printed circuit connectors into “cable” connectors , ensuring the insulation of side terminals on the cable.
Benefits of Hot-melt resins
Not damaged components
Bespoke product through logo application
No housing case required
Excellent adhesion to multiple surfaces
Simplified production process, optimization of cycle time reducing costs.
Reduced production phases
No housing case required
Ready to use finished product, faster process than potting: no polymerization required
Suitable for both small and bigger productions
Moulds can be made in less expensive aluminium
Technomelt ®Working with Henkel enables us to offer our customers moulding with Technomelt® Resins.
By using these resins we can obtain a finished product, which meets specific features including degrees of protection up to IP67.
Main features of Technomelt® resins:
UL94-V0 approved (for almost all resins)
Different colours (Black, Amber, White etc.)
Thermal resistance (-40°C +150°C)
Technomelt® Resins are environment-friendly
ROHS and REACH compliant
Long shelf life
No harmful fumes from moulding process