Low Pressure Moulding

Starline always pays special attention to its customers’ specific needs and requests: for this reason, we have decided to invest in innovative technologies such as low pressure moulding. By using this technology, we are able to offer our customers an innovative service and, above all, we are able to solve problems that customers are likely to encounter when using standard methods of encapsulation.

Process

Stampaggio low pressure

Applications

Stampaggio low pressure

Benefits

Stampaggio low pressure

Cost-saving technology

Stampaggio low pressure

Resins

Stampaggio low pressure

Sustainability

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Stampaggio low pressure

About Low Pressure Moulding:

Low pressure moulding is an innovative technology made by using polyamide-based resins (e.g. TECHNOMELT ®). Through this process it is possible to encapsulate particularly fragile electrical and electronic components, making them more robust, insulated from external agents and ready to use. In fact, thanks to the low injection pressures, we can apply this process also on the main electronic components (both traditional and smd) on PCBs, without damaging them.

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This moulding technique reduces the duration of the production
cycle, compared both to potting, which requires long curing times, and to traditional moulding, which involves subsequent assembly phases.

Through low pressure moulding the process will take just a few minutes to obtain a finished product ready for use. This process does not involve any additional step. In addition, you will spare time and money. Finally, you can obtain a precise design, which will result in minimizing the size and containing material costs.

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Placement of the PCB or other moulding device, moulding, removal
of the final product
Stampaggio low pressure

Moulded cable fairleads

This technology allows us to create custom-made cable fairleads  . The end result is a bespoke finished product incorporated on the cable, thus, preventing any coupling that could generate infiltrations.

Main applications

Insulation of PCBs and sensors


Thanks to the low injection pressures, it is possible to apply this process also on the main electronic components (both traditional and smd)  on PCBs, without damaging them  . The result is a ready to use  and solid finished product, which is protected from external agents such as dust, water, humidity.

Moulded connectors

 

Technomelt resins can also be used to mould connectors, thus offering the customer the highest degree of flexibility on finished products. By way of example, it is possible to transform printed circuit connectors into “cable” connectors , ensuring the insulation of side terminals on the cable.

Stampaggio low pressure

Benefits of Hot-melt resins

green_checkNot damaged components

green_checkCustom design

green_checkBespoke product through logo application

green_checkNo housing case required

green_checkExcellent adhesion to multiple surfaces

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Cost-saving technology

Simplified production process, optimization of cycle time reducing costs.

green_checkReduced production phases

green_checkNo housing case required

green_checkReady to use finished product, faster process than potting: no polymerization required

green_checkSuitable for both small and bigger productions

green_checkFast cycles

green_checkMoulds can be made in less expensive aluminium

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Our resins

henkel-logo

 

Technomelt ®
Technomelt ®Working with Henkel enables us to offer our customers moulding with Technomelt® Resins.

 

By using these resins we can obtain a finished product, which meets specific features including degrees of protection up to IP67.

Main features of Technomelt® resins:

green_checkUL94-V0 approved (for almost all resins)

green_checkDifferent colours (Black, Amber, White etc.)

green_checkThermal resistance (-40°C +150°C)

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Sustainability

Technomelt® Resins are environment-friendly

green_checkRecyclable

green_check  ROHS and REACH compliant

green_checkLong shelf life

green_checkNo harmful fumes from moulding process

green_checkNatural ingredients

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