Site icon Starline

Low Pressure Moulding

Starline always pays special attention to its customers’ specific needs and requests: for this reason, we have decided to invest in innovative technologies such as low pressure moulding. By using this technology, we are able to offer our customers an innovative service and, above all, we are able to solve problems that customers are likely to encounter when using standard methods of encapsulation.

Process

Stampaggio Low Pressure

Applications

Benefits

Cost-saving technology

Resins

Sustainability

About Low Pressure Moulding:

Low pressure moulding is an innovative technology made by using polyamide-based resins (e.g. TECHNOMELT ®). Through this process it is possible to encapsulate particularly fragile electrical and electronic components, making them more robust, insulated from external agents and ready to use. In fact, thanks to the low injection pressures, we can apply this process also on the main electronic components (both traditional and smd) on PCBs, without damaging them.

This moulding technique reduces the duration of the production
cycle, compared both to potting, which requires long curing times, and to traditional moulding, which involves subsequent assembly phases.

Through low pressure moulding the process will take just a few minutes to obtain a finished product ready for use. This process does not involve any additional step. In addition, you will spare time and money. Finally, you can obtain a precise design, which will result in minimizing the size and containing material costs.

Placement of the PCB or other moulding device, moulding, removal
of the final product

Moulded cable fairleads

This technology allows us to create custom-made cable fairleads  . The end result is a bespoke finished product incorporated on the cable, thus, preventing any coupling that could generate infiltrations.

Main applications

Insulation of PCBs and sensors


Thanks to the low injection pressures, it is possible to apply this process also on the main electronic components (both traditional and smd)  on PCBs, without damaging them  . The result is a ready to use  and solid finished product, which is protected from external agents such as dust, water, humidity.

Moulded connectors

 

Technomelt resins can also be used to mould connectors, thus offering the customer the highest degree of flexibility on finished products. By way of example, it is possible to transform printed circuit connectors into “cable” connectors , ensuring the insulation of side terminals on the cable.

Benefits of Hot-melt resins

Not damaged components

Custom design

Bespoke product through logo application

No housing case required

Excellent adhesion to multiple surfaces

Cost-saving technology

Simplified production process, optimization of cycle time reducing costs.

Reduced production phases

No housing case required

Ready to use finished product, faster process than potting: no polymerization required

Suitable for both small and bigger productions

Fast cycles

Moulds can be made in less expensive aluminium

Our resins

 

Technomelt ®
Technomelt ®Working with Henkel enables us to offer our customers moulding with Technomelt® Resins.

 

By using these resins we can obtain a finished product, which meets specific features including degrees of protection up to IP67.

Main features of Technomelt® resins:

UL94-V0 approved (for almost all resins)

Different colours (Black, Amber, White etc.)

Thermal resistance (-40°C +150°C)

Sustainability

Technomelt® Resins are environment-friendly

Recyclable

  ROHS and REACH compliant

Long shelf life

No harmful fumes from moulding process

Natural ingredients